This part of IEC 60749 is applicable to both discrete devices and integrated circuits. The objective of this test is to ascertain whether the device ignites due to internal heating caused by excessive overloads. Note: This test is identical to the procedure outlined in Chapter 4, Section 1.1 of IEC 60749 (1996), with the exception […]

This section of IEC 60749 outlines a testing procedure to evaluate the capacity of semiconductor devices, components, and/or board assemblies to endure mechanical stresses caused by alternating extreme high and low temperatures. These mechanical stresses may lead to permanent alterations in electrical and/or physical characteristics. This test method generally aligns with IEC 60068-2-14; however, due

The neutron irradiation test is conducted to assess the vulnerability of semiconductor devices to degradation in a neutron environment. The procedures outlined here apply to both integrated circuits and discrete semiconductor devices, and this test is specifically intended for military and space-related applications. It is classified as a destructive test. The goals of the test

This section of IEC 60749 outlines various tests aimed at assessing the integrity of the lead/package interface and the lead itself when the leads are bent due to improper board assembly followed by the rework of the component for re-assembly. For hermetic packages, it is advisable to conduct hermeticity tests in accordance with IEC 60749-8

This section of IEC 60749 specifies the rapid temperature change test method and the two-fluid bath method. When both testing methods are conducted as part of a device qualification, the results from air to air temperature cycling should prevail over this two-fluid-bath test method. This test method can also be used, with fewer cycles (e.g.,

This section of IEC 60749 outlines a steady-state temperature and humidity bias life test, which is conducted to assess the reliability of non-hermetic solid-state devices when packaged and exposed to humid conditions. NOTE: While this test aligns generally with IEC 60068-2-3 (withdrawn) 1, it is tailored to meet the specific needs of semiconductors, as indicated

This standard applies to the radiation characteristics and immunity to electromagnetic disturbances of active and passive equipment for the reception, processing, and distribution of television, sound, and interactive service signals. It is part of IEC 60728 series: IEC 60728-3 – “Active coaxial wideband distribution equipment” IEC 60728-4 – “Passive coaxial wideband distribution equipment” IEC 60728-5