This section of IEC 60749 outlines various tests aimed at assessing the integrity of the lead/package interface and the lead itself when the leads are bent due to improper board assembly followed by the rework of the component for re-assembly. For hermetic packages, it is advisable to conduct hermeticity tests in accordance with IEC 60749-8 after this test to evaluate any potential adverse effects on the seals and leads resulting from the stresses applied.
This test, along with its specific conditions, is regarded as destructive and is only recommended for qualification testing.
This standard applies to all through-hole devices and surface-mount devices that require lead forming by the user.
