Welcome to this website, where you can query the price of IEC standards, the latest version of IEC standards and the basic introduction of IEC standards.
This section of IEC 60749 outlines a testing procedure to evaluate the capacity of semiconductor devices, components, and/or board assemblies to endure mechanical stresses caused by alternating extreme high and low temperatures. These mechanical stresses may lead to permanent alterations in electrical and/or physical characteristics. This test method generally aligns with IEC 60068-2-14; however, due […]
IEC 60749-25:2003 pdf download Read More »
The neutron irradiation test is conducted to assess the vulnerability of semiconductor devices to degradation in a neutron environment. The procedures outlined here apply to both integrated circuits and discrete semiconductor devices, and this test is specifically intended for military and space-related applications. It is classified as a destructive test. The goals of the test
IEC 60749-17:2003 pdf download Read More »
This section of IEC 60749 outlines various tests aimed at assessing the integrity of the lead/package interface and the lead itself when the leads are bent due to improper board assembly followed by the rework of the component for re-assembly. For hermetic packages, it is advisable to conduct hermeticity tests in accordance with IEC 60749-8
IEC 60749-14:2003 pdf download Read More »
This section of IEC 60749 specifies the rapid temperature change test method and the two-fluid bath method. When both testing methods are conducted as part of a device qualification, the results from air to air temperature cycling should prevail over this two-fluid-bath test method. This test method can also be used, with fewer cycles (e.g.,
IEC 60749-11:2002 pdf download Read More »
This section of IEC 60749 outlines a steady-state temperature and humidity bias life test, which is conducted to assess the reliability of non-hermetic solid-state devices when packaged and exposed to humid conditions. NOTE: While this test aligns generally with IEC 60068-2-3 (withdrawn) 1, it is tailored to meet the specific needs of semiconductors, as indicated
IEC 60749-5:2003 pdf download Read More »
This section of IEC 60748-23 pertains to high-quality hybrid circuits (with films) that include specific customer requirements for quality and reliability, with their quality evaluated based on Qualification Approval. NOTE 1: Hybrid integrated circuits can be either fully completed or partially completed. Partially completed devices are those provided to customers for additional processing. NOTE 2:
IEC 60748-23-5:2003 pdf download Read More »
This section of IEC 60748 pertains to a high-quality approval system for hybrid integrated circuits and film structures. The checklist is designed for use by the internal assessment team of a hybrid microcircuit manufacturer. It aims to provide both the manufacturer and the National Supervising Inspectorate (NSI) with continuous information on process control that demonstrates
IEC 60748-23-3:2002 pdf download Read More »
This standard applies to the radiation characteristics and immunity to electromagnetic disturbances of active and passive equipment for the reception, processing, and distribution of television, sound, and interactive service signals. It is part of IEC 60728 series: IEC 60728-3 – “Active coaxial wideband distribution equipment” IEC 60728-4 – “Passive coaxial wideband distribution equipment” IEC 60728-5
IEC 60728-2:2002 pdf download Read More »
This section of IEC 60695 outlines the mould stress relief distortion test as a testing method intended for use by product committees. It applies to electrotechnical equipment, including components made from polymeric materials. The purpose of this test is to replicate the effects of relieving moulding stresses by conditioning the product or component at a
IEC 60695-10-3:2002 pdf download Read More »
This section of IEC 60695 offers guidance on the following: a) General aspects of corrosion damage test methods; b) Methods of measurement of corrosion damage; c) Consideration of test methods; d) Relevance of corrosion damage data to hazard assessment. One of the responsibilities of a technical committee is, wherever applicable, to make use of basic
IEC 60695-5-1:2002 pdf download Read More »