This part of IEC 60754 specifies the apparatus and procedure for the determination of the amount of halogen acid gas, other than hydrofluoric acid, evolved during the combustion of compounds based on halogenated polymers and compounds containing halogenated additives taken from electric or optical fibre cable constructions. NOTE 1 This test method is not able […]

This part of IEC 60749 specifies the procedural requirements for performing valid endurance,retention and cross-temperature tests based on a qualification specification. Endurance and retention qualification specifications (for cycle counts, durations, temperatures, and sample sizes) are specified in JESD47 or are developed using knowledge-based methods such as in JESD94.

This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the