IEC 60317-19:2000 outlines the requirements for Class 1 30 solderable enameled round copper winding wire with a dual coating system. The base coating is formulated from polyurethane resin, which can be modified as long as it maintains the chemical composition of the original resin and complies with all the specified wire requirements. The outer coating is made from polyamide resin.
NOTE: A modified resin refers to a resin that has undergone a chemical alteration or has been enhanced with one or more additives to improve certain performance or application attributes.
Class 1 30 refers to a thermal class that mandates a minimum temperature index of 130°C and a heat shock temperature of no less than 155°C.
The temperature index in degrees Celsius does not necessarily represent the operating temperature recommended for the wire, which can vary based on numerous factors, including the type of equipment it is used in.
The standard covers a range of nominal conductor diameters:
– Grade 1: from 0.050 mm up to and including 1,600 mm;
– Grade 2: from 0.050 mm up to and including 2,000 mm.
The nominal conductor diameters are detailed in Clause 4 of IEC 60317-0-1.
