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IEC 61192-4:2002 pdf download

IEC 61192-4:2002 pdf download

This section of IEC 61192 specifies the general requirements for the craftsmanship in terminal soldered assemblies, which are attached to organic substrates, printed boards, and similar laminates on the surface of inorganic substrates. It applies to completely terminal or mixed assemblies that incorporate surface-mounting or other related assembly technologies, such as through-hole, wires.

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