Section T of IEC 60068 details Test T, which is relevant to devices equipped with leads. The soldering tests for surface mount devices (SMDs) are detailed in IEC 60068-2-58. The standard offers procedures for assessing the solderability and resistance to soldering heat of components used in applications that employ solder alloys, including eutectic or near-eutectic tin-lead (Pb) solder, as well as lead-free alloys.
The procedures outlined in this standard encompass the solder bath method and the soldering iron method. The aim of this standard is to guarantee that the component leads or terminations exhibit the required solderability, meeting the specifications for solder joints as stipulated in IEC 61191-3 and IEC 61191-4. Furthermore, the standard includes test methods to ensure that the component bodies can withstand the heat loads encountered during the soldering process.
NOTE: Data on wetting time and wetting force can be acquired through test methods utilizing a wetting balance. For further information, refer to IEC 60068-2-54 (solder bath method) and IEC 60068-2-69 (solder bath and solder globule method for SMDs).
