1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections.Four classifications of wire are distinguished, (1) copper-modifed wire, (2) beryllium-modified wire, (3) high-strengh wire, and (4) special purpose wire.
Nore 1- -Trace meallie elements have a signifcant ffect upon the mechanical properties and themal stbility of high-purity gold wire, It is customary in manufacuring to add cotolled amounts of selected impurities to gold to modify or stbiliei bonding wire properties. or both.This practice s known variously a “modifying.” “sabilizing.” or “doping.” The first two wire lassifications denoted in this spesification refer to wine made with either of two particular modibers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the identity of modifying additives is not restricted.
