1.1 This practice descrbes destructive and non-destructive procedures.
1.2 The destructive procedure stresses the sealant in such a way as to cause either cohesive or adhesive failure of the sealant or cohesive failure of the substrate where deficient substrate conditions exist. The objective is to characterize the adhesive/cohesive performance of the sealant on the specifie substrate by applying a strain that correlates to the strain that the sealant bead may experience when subjected to its maxi-mum published movement capability, when known; or a reasonable strain w hen the movement capability is unknown. It is possible that the strain applied to the sealant bead may result in no failure of the sealant or the substrate, failure of a deficient substrate before ffecting a failure in the scalant, or a failure of the sealant.
