This section of IEC 60749 outlines a testing procedure to evaluate the capacity of semiconductor devices, components, and/or board assemblies to endure mechanical stresses caused by alternating extreme high and low temperatures. These mechanical stresses may lead to permanent alterations in electrical and/or physical characteristics.
This test method generally aligns with IEC 60068-2-14; however, due to the specific requirements for semiconductors, the relevant clauses of this standard must be followed.
The test method encompasses single, dual, and triple chamber temperature cycling and includes testing for components and solder interconnections. In single chamber cycling, the device is placed in a stationary chamber where it is heated or cooled by introducing hot, ambient, or cold air. In dual chamber cycling, the device is situated on a moving platform that transitions between two stationary chambers maintained at fixed temperatures. For triple chamber temperature cycling, the device is transferred among three different chambers.
