This section of IEC 60749 outlines a steady-state temperature and humidity bias life test, which is conducted to assess the reliability of non-hermetic solid-state devices when packaged and exposed to humid conditions.
NOTE: While this test aligns generally with IEC 60068-2-3 (withdrawn) 1, it is tailored to meet the specific needs of semiconductors, as indicated by the following text.
It is noted that this testing method is considered to be destructive.
