This section of IEC 60749 outlines a testing method designed to assess and compare the drop performance of surface mount electronic components intended for handheld electronic devices in an accelerated testing environment. This method simulates excessive flexing of a circuit board, which can lead to product failures. The goal is to standardize both the test board and the testing methodology to ensure a consistent evaluation of drop test performance for surface-mounted components, while replicating the same failure modes typically observed during product-level testing.
The aim of this standard is to establish a uniform testing method and reporting procedure. It is important to note that this is not a component qualification test and is not intended to substitute any system-level drop tests required for the qualification of specific handheld electronic products. Additionally, this standard does not address drop tests meant to simulate shipping and handling shocks for electronic components or PCB assemblies, as those requirements are already covered in methods such as IEC 60749-10. This testing method is applicable to both area array and perimeter-leaded surface-mounted packages.
In this test method, an accelerometer is utilized to measure the duration and magnitude of the mechanical shock applied, which correlates to the stress experienced by a component mounted on a standardized board. The forthcoming IEC 60749-401 test method will employ a strain gauge to measure the strain and strain rate of the board near a component. The specific details will dictate which testing method should be utilized.
