This document pertains to components and assemblies that incorporate both lead-free and lead-containing solders and finishes. It details the marking of components and the labeling of their shipping containers to denote their second-level terminal finish or material. It is applicable to components designed for attachment to boards or assemblies via soldering, mechanical clamping, or press-fit methods. Additionally, it covers second-level terminal materials for bumped dice intended for direct board attachment.
The document also applies to boards and assemblies to indicate the type of lead-free or lead-containing solder employed. It outlines a method for identifying surface finishes of boards and the resin systems of Printed Circuit Boards (PCBs). Furthermore, it addresses the marking of conformal coating types used on Printed Circuit Board Assemblies (PCBAs). Materials and their containers that have already been marked or labeled in accordance with JESD 97 or IPC-1066 do not require re-labeling unless agreed upon by both the supplier and customer.
The labeling of the exterior surfaces of finished products like computers, printers, servers, and similar items is not within the scope of this document. However, internal PCBs and PCBAs are included. The labeling of retail packaging for electronic products is also excluded from the scope of this document.
