This part of IEC 61188 provides information on the land pattern geometries used for surface attachment of electronic components with J leads on four sides.
The objective of this standard is to offer the appropriate size, shape, and tolerances of surface-mount land patterns to ensure sufficient area for the appropriate solder fillet, while also allowing for inspection, testing, and reworking of resulting solder joints.
Each clause contains a specific set of criteria, detailing the component, the component dimensions, the solder joint design, and the land pattern dimensions.
NOTE: The acronym QFJ is the naming convention used by Japan; the acronym PLCC is the naming convention used by the USA for these components.
