This section of IEC 60695 outlines the mould stress relief distortion test as a testing method intended for use by product committees. It applies to electrotechnical equipment, including components made from polymeric materials.
The purpose of this test is to replicate the effects of relieving moulding stresses by conditioning the product or component at a temperature exceeding the maximum normal operating temperature, and then observing the nature of any resulting changes.
Additionally, one of the responsibilities of a technical committee is to incorporate basic safety publications in the development of its own materials whenever appropriate.
